New version of HDPLEX H1 series Fanless PC case has the following changes.
1：SSD installation position is being moved to the bottom plate below the motherboard. There is a “bathtub” being carved on the bottom plate for one SSD position or maybe two if it is super slim SSD (<7mm). This change enable H1.SODD to support regular SSD and to allow better heat dissipation since nothing will block the aluminum top plate. Old H1.SODD only supports mSATA/M.2 SSD.
2: CPU aluminum top plate will have teeth. Increase the heat dissipation area and thus efficiency.
3: Improve the backplate for Thin mini ITX PCI Expansion card installation. Due to the decrease of thin ITX mobo options, I might make this thin ITX blackplate an option instead of include it by default. There is no thin ITX board for Intel Boardwell nor for Skylake CPU. Did they give up on Thin ITX??
4: Side I/O board will be improved. One side I/O board with soft silicon based USB 3.0 cable and power button will replace the original two side I/O boards. So only one side will have side I/O. Silicon USB 3.0 head is very low profile as well.
5: New H1 faceplate will have new mounting pattern for power supply.
The mounting for 250W HiFi DC-ATX is unchanged.
New H1.S will support:
1： HDPLEX 160W AC-DC+HDPLEX Direct Plug Style 160W DC-ATX (like PicoPSU). This direct plug style 160W DC-ATX is not released yet.
2: HDPLEX 80W AC-DC+HDPLEX 160W DC-ATX
3: HDPLEX 250W HiFi DC-ATX
New H1.SODD will support mini-ITX (with 24PIN on the side only) in addition to thin-ITX.
1： HDPLEX 160W AC-DC+HDPLEX Direct Plug Style 160W DC-ATX (like PicoPSU) if the motherboard 24PIN ATX plug is on the side instead of being on the front.
H1.S will have an updated SSD rack which support two SSD. So H1.S will support max 3 SSD, two via this rack and one on the bottom bathtub.